Portable disc to measure chemical gas contaminants within semiconductor equipment and clean room

ABSTRACT

A detector disc includes a disc body having a bottom disc and a top cover, the top cover including a first aperture. A sensor is disposed inside the disc body and positioned to be exposed to an external environment via the first aperture in the top cover. The solid state sensor is adapted to detect levels of chemical gas contaminants and output a detection signal based on detected levels of the chemical gas contaminants. A microcontroller is disposed on the PCB and adapted to generate measurement data from the detected levels of the chemical gas contaminants embodied within the detection signal. A wireless communication circuit is disposed on the PCB, the wireless communication circuit adapted to transmit the measurement data wirelessly to a wireless access point device.

TECHNICAL FIELD

Some embodiments of the present invention relate, in general, to aportable disc to measure chemical gas contaminants within semiconductorequipment and/or clean rooms.

BACKGROUND

For years, the main focus for semiconductor equipment, clean room, andother such clean fabrication (“fab”) environments has been to removemechanical particles from the air known to cause defects in thin filmslaid down for processing, and thus reduce the number of defects orerrors in semiconductor manufactured devices. More recently, this focushas expanded to the reduction of chemical gas contaminants generallyreferred to as airborne molecular contaminants (AMCs) and volatileorganic compounds (VOCs). For example, fabs have begun using chemicalpre-filters to filter already filtered air in the fab level to filtereven more at the processing tool level. Process manufacturers have begunto change manufacturing processes to clean vacuum parts to ensure smalltrace amounts of chemical gas contaminants do not make it into theproduction environment. These are not inexpensive measures, and despitethese efforts, the complexity of semiconductor processing system toolsmakes it difficult to determine where in a multi-step, multi-toolprocess substrates may be getting exposed to too high a concentration ofany number of chemical gas contaminants.

SUMMARY

Some embodiments described herein cover a detector disc including a discbody comprising a bottom disc and a top cover, the top cover comprisinga first aperture. The detector disc may further include a printedcircuit board (PCB) positioned within an interior formed by the discbody. The detector disc may further include a sensor disposed on the PCBand positioned to be exposed to an external environment via the firstaperture in the top cover. The sensor may be adapted to detect levels ofchemical gas contaminants and output a detection signal based ondetected levels of the chemical gas contaminants. The detector disc mayfurther include a microcontroller disposed on the PCB and coupled to thesensor, the microcontroller adapted to generate measurement data fromthe detected levels of the chemical gas contaminants embodied within thedetection signal. The detector disc may further include a wirelesscommunication circuit disposed on the PCB, the wireless communicationcircuit adapted to transmit the measurement data wirelessly to awireless access point device.

In other embodiments, the detector disc instead includes a substratedisc and a printed circuit board (PCB) disposed on a central portion ofthe substrate disc. The detector disc may further include a sorbent tubeattached to the substrate disc, the sorbent tube comprising a firstopening at a first end that is capped and a second opening at a secondend. The detector disc may further include a micro-electromechanicalsystem (MEMS) pump disposed on one of the substrate disc or the PCB andincluding an air tube attached to the second opening of the sorbent tubeto force ambient air into the sorbent tube, wherein the MEMS pump is toautomatically shut off after a calibrated time period after activation.The detector disc may further include a microcontroller disposed on thePCB and coupled to the MEMS pump, the microcontroller to activate thepump.

In example embodiments, a method is disclosed for using a detector discfor detecting levels of chemical gas contaminants in air. The method maybegin with moving, by a first robot, the detector disc from a storagelocation through a factory interface into a load lock of a processingsystem. The detector disc may include a sensor adapted to detect levelsof chemical gas contaminants in air; and a wireless communicationcircuit coupled to the sensor The method may continue with moving, by asecond robot, the detector disc from the load lock through a transferchamber and into a processing chamber of the processing system. Themethod may continue with detecting, using the sensor of the detectordisc, the levels of chemical gas contaminants within at least one of thestorage location, the factory interface, the load lock, the transferchamber, or the processing chamber. The method may continue withtransmitting, with the wireless communication circuit of the detectordisc, measurement data wirelessly to a wireless access point (WAP)device, wherein the measurement data comprises information indicative ofthe detected levels of chemical gas contaminants within the at least oneof the storage location, the factor interface, the load lock, thetransfer chamber, or the processing chamber.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is illustrated by way of example, and not by wayof limitation, in the figures of the accompanying drawings in which likereferences indicate similar elements. It should be noted that differentreferences to “an” or “one” embodiment in this disclosure are notnecessarily to the same embodiment, and such references mean at leastone.

FIG. 1 is a simplified top view of an example processing system,according to aspects of the disclosure.

FIGS. 2A-2B are top, perspective views of a detector disc according toaspects of the disclosure.

FIGS. 2C-2D are cross-section views along a center of the detector discaccording to aspects of the disclosure.

FIG. 2E is an exploded, perspective view of the detector disc accordingaspects of the disclosure.

FIG. 3A is a top, plan view of a detector disc that employs a sorbenttube to gather chemical gas contaminants according to aspects of thedisclosure.

FIG. 3B is a sorbent tube according to an aspect of the disclosure.

FIG. 4 is a block schematic diagram of a host printed circuit board(PCB) for the detector disc according to aspects of the disclosure.

FIG. 5 is a block schematic diagram of a serial communication interfacebetween the host PCB and a transmitter board that includes a sensoraccording to aspects of the disclosure.

FIG. 6 is a schematic block diagram illustrative of a method forconverting detection signals into measurement data for detected levelsof chemical gas contaminants and securely transmitting the measurementdata according to aspects of the disclosure.

FIG. 7 is a flow chart of a method for using a detector disc, whichincludes a sensor for detecting levels of chemical gas contaminantsaccording various aspects of the disclosure.

FIG. 8 is a flow chart of a method for using a detector disc, whichincludes a sorbent tube, for detecting levels of chemical gascontaminants according various aspects of the disclosure.

DETAILED DESCRIPTION OF EMBODIMENTS

Embodiments of the present disclosure provide a detector disc andrelated methods for detecting levels of chemical gas contaminants withinsemiconductor processing equipment, fabrication, and clean roomenvironments. The chemical gas contaminants may include levels ofdifferent types of airborne molecular contaminants (AMCs) and/orvolatile organic compounds (VOCs). The disclosed embodiments provide away to detect these chemical gas contaminants within a known part of aprocessing system, whether in a storage location for substrates, in aload lock or other intermediate station, a transfer chamber, or aprocessing chamber or the like.

Various embodiments may be or employ a detector disc that is of athickness and diameter that the detector disc can be transferred as anyother substrate through the processing system. In one embodiment, thedetector disc includes a solid state sensor adapted to, while beingtransferred within the processing system, detect levels (e.g., down toless than two parts per million) of different chemical gas contaminantsand output a detection signal based on the detected levels. Amicrocontroller coupled to the solid state sensor generates measurementdata from the detected levels of the chemical gas contaminants embodiedwithin the detection signal. A wireless communication circuit wirelesslytransfers the detected levels to a wireless access point (WAP) devicefor capture. In related embodiments, the measurement data is stored inmemory of the detector disc for later extraction, and thus may not havewireless capability in some environments. The measurement data iscorrelated with position of the detector disc within the processingsystem, and thus provide information about the detected levels of thechemical gas contaminants separately within a storage location, afactory interface, a load lock, a transfer chamber, or a processingchamber, to name a few.

In an alternative embodiment, the detector disc instead employs one ormore sorbent tube attached to a substrate disc, and amicro-electromechanical system (MEMS) pump is adapted to force ambientair into the sorbent tube. A microcontroller activates the MEMS pumpupon movement (or some other trigger) and the MEMS pump automaticallyshuts off after a calibrated time period after activation or responsiveto a shutoff signal. The shut off of the MEMS pump traps the ambient airin the sorbent tube, so that after the detector disc is transferred backout of the processing system, the sorbent tube can be capped andtransferred to an analysis lab. The sorbent tube is processed using gaschromatography to determine the levels of chemical gas contaminants inthe sorbent tube. While this embodiment may be slower, use of sorbenttubes and gas chromatography can yield more accurate results.

These and similar embodiments provide a number of advantages andimprovements in the field of semiconductor processing of substrates suchas wafers. These advantages include an improvement in substrateperformance (e.g., yield) and in a lower cost of ownership due toincreased yields. Substrate manufacturing performance can be increased,for example, due to knowing where ambient air has too high a level ofdifferent kinds of chemical gas contaminants and targeting additionalchemical gas filtration in these areas or tools. Furthermore, themonitoring of the levels of chemical gas contaminants may be continuousand substrate processing need not be shut down to detect and addresscertain high level concentrations in certain semiconductor processingtools or fab areas.

FIG. 1 illustrates a simplified top view of an example processing system100, according to one aspect of the disclosure. The processing system100 includes a factory interface 91 to which a plurality of substratecassettes 102 (e.g., front opening unified pods (FOUPs) and a sidestorage pod (SSP)) may be coupled for transferring substrates (e.g.,wafers such as silicon wafers) into the processing system 100. The FOUP,SSP, and other substrate cassettes may together be referred to herein asstorage locations. In embodiments, one or more of the substratecassettes 102 include, in addition to or instead of wafers to beprocessed, detector discs 110. Detector discs 110 may be used to detectlevels of chemical gas contaminants within one or more processingchamber 107 and other compartments and chambers as will be discussed.The factory interface 91 may also transfer the detector discs 110 intoand out of the processing system 100 using the same functions fortransferring wafers as will be explained.

The processing system 100 may also include first vacuum ports 103 a, 103b that may couple the factory interface 91 to respective stations 104 a,104 b, which may be, for example, degassing chambers and/or load locks.Second vacuum ports 105 a, 105 b may be coupled to respective stations104 a, 104 b and disposed between the stations 104 a, 104 b and atransfer chamber 106 to facilitate transfer of substrates into thetransfer chamber 106. The transfer chamber 106 includes multipleprocessing chambers 107 (also referred to as process chambers) disposedaround the transfer chamber 106 and coupled thereto. The processingchambers 107 are coupled to the transfer chamber 106 through respectiveports 108, such as slit valves or the like.

The processing chambers 107 may include one or more of etch chambers,deposition chambers (including atomic layer deposition, chemical vapordeposition, physical vapor deposition, or plasma enhanced versionsthereof), anneal chambers, and the like. In various embodiments, thefactory interface 91 includes a factory interface robot 111. The factoryinterface robot 111 may include a robot arm, and may be or include aselective compliance assembly robot arm (SCARA) robot, such as a 2 linkSCARA robot, a 3 link SCARA robot, a 4 link SCARA robot, and so on. Thefactory interface robot 111 may include an end effector on an end of therobot arm. The end effector may be configured to pick up and handlespecific objects, such as wafers. Alternatively, the end effector may beconfigured to handle objects such as the detector discs 110. The factoryinterface robot 111 may be configured to transfer objects betweensubstrate cassettes 102 (e.g., FOUPs and/or SSP) and stations 104 a, 104b.

The transfer chamber 106 includes a transfer chamber robot 112. Thetransfer chamber robot 112 may include a robot arm with an end effectorat an end of the robot arm. The end effector may be configured to handleparticular objects, such as wafers, edge rings, ring kits, and detectordiscs. The transfer chamber robot 112 may be a SCARA robot, but may havefewer links and/or fewer degrees of freedom than the factory interfacerobot 111 in some embodiments.

A controller 109 may control various aspects of the processing system100 and may include or be coupled to a wireless access point (WAP)device 129. The WAP device 129 may include wireless technology and oneor more antenna with which to communicate with the detector discs 110.The controller 109 may be and/or include a computing device such as apersonal computer, a server computer, a programmable logic controller(PLC), a microcontroller, and so on. The controller 109 may include oneor more processing devices such as a microprocessor, central processingunit, or the like. More particularly, the processing device may be acomplex instruction set computing (CISC) microprocessor, reducedinstruction set computing (RISC) microprocessor, very long instructionword (VLIW) microprocessor, or a processor implementing otherinstruction sets or processors implementing a combination of instructionsets. The processing device may also be one or more special-purposeprocessing devices such as an application specific integrated circuit(ASIC), a field programmable gate array (FPGA), a digital signalprocessor (DSP), network processor, or the like.

Although not illustrated, the controller 109 may include a data storagedevice (e.g., one or more disk drives and/or solid state drives), a mainmemory, a static memory, a network interface, and/or other components.The controller 109 may execute instructions to perform any one or moreof the methodologies and/or embodiments described herein. Theinstructions may be stored on a computer readable storage medium, whichmay include the main memory, static memory, secondary storage and/orprocessing device (during execution of the instructions). For example,the controller 109 may execute the instructions to activate one or morechemical gas filters that are located within the different storagelocations, the factory interface 91, the load lock or stations, thetransfer chamber 106, or in any of the processor chambers 107 inresponse to detection of elevated levels of chemical gas contaminants inany one of these processing tool units or chambers.

FIGS. 2A-2B are top, perspective views of the detector disc 110according to aspects of the disclosure. FIGS. 2C-2D are cross-sectionviews along a center of the detector disc 110 according to aspects ofthe disclosure. FIG. 2E is an exploded, perspective view of the detectordisc 110 according aspects of the disclosure. In various embodiments,and with reference to these various views, the detector disc 110includes a disc body that includes a substrate 201 and a top cover 203having a sidewall 204 attached to the substrate 201. Alternatively, thesubstrate 201 may have side walls, and the top cover may be a lid thatis disposed on the side walls of the substrate 201. In one embodiment,the substrate 201 includes a depression formed in the substrate 201. Thetop cover may be disposed over the depression. In one embodiment, thedisc body is between 6 millimeters (mm) and mm thick and the diameter ofthe disc body (e.g., of the substrate 201) is approximately 190 mm to320 mm and/or otherwise sized to be passed through slits and aperturesof the processing system 100.

In various embodiments, the detector disc includes a printed circuitboard (PCB) 220 positioned within an interior of the disc body, e.g.,between the top cover 203 and the substrate 201. The sidewall 204 mayenclose the PCB 220 within the disc body. A number of electricalcomponents may be disposed inside of the disc body (e.g., on the PCB 220or on a combination electronics boards), including a toggle on/offswitch 213, a Universal Serial Bus (USB) interface connector 215, amemory card 217, a battery 225, one or more sensor 226, one or moreaxial fan 228, and a microcontroller 230. The one or more axial fan 228may be disposed on the PCB 220 via a seal or bond. The one or more axialfan 228 facilitates air flow orthogonal to the one or more axial fan 228without side leakage of the air. The battery 225 may power theelectrical components that use power with the help of a power manager,discussed with reference to FIG. 4.

In disclosed embodiments, the microcontroller 230 is a controlleradapted to interface with the electrical components, including theconnectors, the memory card 217, and the one or more sensor 226. Themicrocontroller 230 may be a programmed processor, a field programmablegate array (FPGA), an application-specific integrated circuit (ASIC), orother special purpose processing device. The microcontroller 230 may beadapted to receive detection signals from the sensor 226 upon the sensor226 detecting certain levels of concertation of chemical gascontaminants. The microcontroller 230 may also be configured orprogramed to generate measurement data from the detected levels of thechemical gas contaminants embodied within the detection signal.Functionality and capability of the microcontroller 230 will bediscussed in more detail with reference to FIG. 4 and FIG. 6. Inembodiments, the sensor 226 is a solid state sensor, an optical device,an electrochemical device, an electrical device, a mass sensitivedevice, a magnetic device, a thermometric device, or a combinationthereof. The sensor 226 can be calibrated within air located outside thefactory interface 91 that includes the storage location. The calibratingmay include establishing a baseline of levels of the chemical gascontaminants detected by the one or more sensor 226.

In some embodiments, the sidewall 204 of the top cover 203 includes atleast one opening, e.g., a first opening 204A through which the toggleon/off switch 213 is exposed and a second opening 204B through which theUSB interface connector 215, and the memory card 217 are exposed.Additional or fewer openings may be employed depending on design. Thememory card 217 may be removable and be adapted to store measurementdata that includes the levels of concentration of different chemical gascontaminants that the sensor 226 is capable of detecting. A wirelesscharger 235 may also be provided that is adapted to wireless charge thedetector disc 110.

In one embodiment, the sensor 226 is a micro solid state sensor adaptedto detect the levels of chemical gas contaminants in parts per million(ppm) of particles of at least one of airborne molecular contaminants orvolatile organic compounds, e.g., down to below two ppm and as high as2000 ppm. In one embodiment, the micro solid state sensor is capable ofdetecting at least 23 different such chemical gases (AMCs and/or VOCs),e.g., ammonia (NH₃), carbon dioxide (CO₂), chlorine (Cl₂), hydrogencyanide (HCN), Sulphur dioxide (SO₂), and many others. The micro solidstate sensor may use amperometric, three-electrode advanced solid statetechnology in some embodiments.

In various embodiments, the sensor 226 is adapted to measure fiftypercent of a concentration of the levels of the chemical gascontaminants within 10 seconds and measure ninety percent of theconcentration of the levels of the chemical gas contaminants within 30seconds. The sensor 226 may be about 12.5 mm by 11.5 mm by 9.5 mm insize, or within 5-20% of this size in various dimensions, and thus sizedto allow multiple sensors to fit on the PCB 220 (e.g., illustrated arefour sensors by way of example). The sensor 226 may also operate in arange in temperature between −20° C. and +50° C., and thus be adaptableto the processing chamber environment.

In various embodiments, the top cover 203 includes one or more firstaperture 206 through which a detector surface of the one or more sensor226 may be exposed to an external environment. The top cover 203 mayalso include one or more second aperture 208 that is proximate to thefirst aperture 206, through which the one more axial fan 228 can pullair from the external environment. The axial fan 228 may be disposed onthe PCB 220 below the second aperture 208, such that the axial fan 228moves the air across the sensor 226 disposed proximate to the axial fan228. In an embodiment, the PCB 220 includes one or more third aperture222 over which to dispose the one or more axial fan 228. In other words,the axial fan 228 can be disposed on the PCB 220 between the second andthird apertures to move air across the sensor 226 in through the secondaperture 208 and out through the third aperture 222 of the PCB 220.

In disclosed embodiments, the axial fan 228 moves air in this way toincrease air flow and thus sensitivity, by the one or more sensor 226,to detection of the chemical gas contaminants, as illustrated by thedirection of air flow (illustrated with arrows) in FIG. 2D. Themicrocontroller 230 may control the speed of the axial fan 228, e.g.,via use of pulse width modulation (PWM) to vary the force of the airflow and therefore the sensitivity of the sensor 226.

In various embodiments, the top cover 203 includes a set of firstapertures 206 (e.g., four first apertures) and the detector disc 110includes a set of sensors 226 (e.g., four sensors) disposed on the PCB220. Each sensor of the set of sensors may be positioned proximate toone of the set of first apertures 206. In a related embodiment, the topcover 203 includes a set of second apertures 208 (e.g., four secondapertures) proximate to the set of first apertures 206. The PCB 220 mayfurther include a set of third apertures 222 (e.g., four thirdapertures) positioned below the set of second apertures 208. Thedetector disc 110 may include a set of axial fans 228 disposed on thePCB 220 between the set of second apertures 208 and the set of thirdapertures 222. The set of axial fans 228 may move air across the set ofsensors 226.

FIG. 3A is a top, plan view of a detector disc 310 that employs asorbent tube 326 to gather chemical gas contaminants according toaspects of the disclosure. FIG. 3B is a sorbent tube 326 according to anaspect of the disclosure. The sorbent tube 326 includes a glass tube 371with sealing caps 375 at either end. The glass tube 371 is drawn to veryclose tolerances for repeatable results. The glass tube 371 includesprecision-sealed tips 373, which permit safe, easy breaking to thespecified opening size and sealing caps 375, which prevent contaminationand to seal the glass tube 371 shut. Inside the glass tube 371 isdisposed a sorbent layer 377, which has a precisely controlled surfacearea, pore size, absorptive characteristics, and mesh size. Alsodisposed in the glass tube 371 is a backup sorbent layer 379, whichdetects sample breakthrough. The sorbent layers 377 and 379 include foamseparators 381 to provide a uniform pressure drop within the glass tube371. Also inside the glass tube 371 is disposed a precise amount of ahigh-purity glass wool 383 also to provide a uniform pressure drop.

With continued referenced to FIG. 3A, in various embodiments, thedetector disc 310 includes a substrate disc 301 and an optional printedcircuit board (PCB) 320. In some embodiments, the detector disc 310includes one or more sorbent tube 326 attached to the substrate 301,e.g., with the use of a clamp 327 or other connector (e.g., a glue,bonding agent, clip, magnet, etc.). The detector disc 310 may alsoinclude a battery 325 attached to the substrate disc 301 to providepower to the PCB 320 and electronics disposed thereon. The electronicsmay include, for example, a toggle on/off switch 313, a USB interfaceconnector 315, and a memory card 317 disposed on the PCB 320. Amicrocontroller 330 may be disposed on one of the substrate disc 301 orthe PCB 320. These components are similar to those introduced anddiscussed with reference to detector disc 110 of FIGS. 2A-2E.

In various embodiments, the electronics include one or moremicro-electromechanical system (MEMS) pump 329 disposed on the PCB 320.In an alternative embodiment, although not illustrated, the MEMS pump329 is disposed on the substrate disc 301. Each MEMS pump 329 includesan air tube 331 attached to an opening of the sorbent tube 326. The MEMSpump 329 is adapted to force ambient air into the sorbent tube 326,e.g., through the air tube 331, and may be programmed or configured toautomatically shut off after a calibrated time period after activation.Alternatively, the MEMS pump 329 may shut off responsive to a shutoffsignal (e.g., which may be wireless received from a controller) or maybe shut off responsive to a sensor reading. For example, a sensor maydetect a volume of gas pumped into a sorbent tube 326, and the MEMS pump329 may be shut off responsive to the volume of gas meeting a threshold.In various embodiments, the ambient air is ambient air of at least oneof a storage location, the factory interface 91, the load lock 104 a or104 b, the transfer chamber 106, or one of the processing chambers 107of the substrate processing system 100.

The microcontroller 330 may be a programmed processor, a FPGA, anapplication-specific integrated circuit (ASIC) or other controller. Themicrocontroller 330 may be configured to activate the MEMs pump 329,e.g., after detection of movement of the detector disc 301 or some othertrigger and/or to shut off the MEMS pump 329, e.g., responsive to atimer timing out, responsive to an external signal, responsive to ameasurement from a sensor (e.g., that indicates an amount of gas pumpedinto a sorbent tube), or responsive to some other condition.

In further embodiments, the detector disc 310 includes at least a secondsorbent tube attached to the substrate disc 301, the second sorbent tubeincluding an opening at a first end that is capped and a second openingat a second end that is not capped. A second MEMS pump is disposed onthe PCB 320 and that includes a second air tube attached to the secondopening of the second sorbent tube to force ambient air into the secondsorbent tube. The second MEMS pump may be adapted to automatically shutoff after the calibrated time period after activation, and themicrocontroller 330 further coupled to the second MEMS pump to activatethe second MEMS pump.

FIG. 4 is a block schematic diagram of a host printed circuit board(PCB) 420 for the detector disc 110 or 310 according to aspects of thedisclosure. The host PCB 420 may therefore be the PCB 220 or PCB 320 indifferent embodiments, may be a combination of printed circuit boards,and have a number of similar electrical components disposed thereon. Forexample, the host PCB 420 may include a memory card 417 to store data, asensor 426 (e.g., solid state sensor) disposed on a transmitter board426A, one or more axial fan 428, a MEMS pump 429 disposed on atransmitter board 429A, a microcontroller 430, a wireless communicationcircuit 440, and a power manager 450. As with the detector discs 110 and310, the PCB 420 may include multiple MEMS pumps 429, each on its owntransmitter board 429A, and multiple sensors 426, each on its owntransmitter board 426A. Each of the one or more axial fans 428 may bedisposed in proximity or adjacent to one of the sensors 426.

In various embodiments, the wireless communication circuit 440 isadapted to transmit wirelessly, e.g., to the WAP 129, either or both ofthe detection signals (received from the one or more sensor 426) ormeasurement data that includes the detection signal after conditioningand processing, as will be discussed in more detail with reference toFIG. 6. The wireless communication circuit 440 and the WAP 129, andother wireless enabled devices, may communicate using one or more ofvarious communication standards or protocols such as WiFi™ of the WiFi™Alliance, Wireless USB®, Bluetooth®, Zigbee®, secure shell (SSH),internet-of-thing (IoT) gateway, or the like.

In various embodiments, the transmitter board 429A on which is disposedthe MEMS pump 429 transmits signals between the MEMS pump 429 and themicrocontroller 430. The transmitter board 426A on which is disposed thesensor 426 may transmit signals between the sensor 426 and themicrocontroller 430.

In one embodiment, the measurement data is stored on the memory card417. The memory card 417 may be removable for insertion into a memorycard reader or the like on a computing device in order to extract themeasurement data.

In various embodiments, the power manager 450 is adapted to convertpower from the battery 225 or 325 into a proper power and current levelfor the electrical components disposed on the host PCB 420. For example,the power manager 450 receives a five volt power supply at a chargecontroller 452 with which to charge a 3.7 volt battery 455. A firstlight emitting diode (LED) 453 may indicate whether the 3.7 volt battery455 is charging and a second LED 454 may indicate when the charging isdone. The 3.7 volts may be sufficient for some of the componentsdisposed on the host PCB 420, such as the PCB 420, transmitter boards426A and 429A, and the axial fan(s) 428.

In these embodiments, the power manager 450 may also include a boosterconverter 456 coupled to the charge controller 452 and adapted to boosta voltage source of the battery to a level (e.g., five volts) sufficientto power at least the microcontroller 430, the sensor 426, and thememory card 417. A third LED 457 may indicate a low power level of thebattery 225 or 325 and a fourth LED 459 may indicate that the detectordisc 110 or 310 is on. The power manager 450 may also include an on/offbutton 458 in order cycle on or off the power to the host PCB 420.

FIG. 5 is a block schematic diagram of a serial communication interface500 between the host PCB 420 and a transmitter board 426A that includesthe sensor 426 according to aspects of the disclosure. In variousembodiments, the serial communication interface 500 is aninter-integrated circuit interface (e.g., I2C or I²C), a serialperipheral interface (SPI), or an asynchronous serial interface, or thelike. The inter-integrated circuit (I²C) protocol is a protocol intendedto allow multiple “slave” digital integrated circuits (“chips”) tocommunicate with one or more “master” chips. In the present disclosure,the microcontroller 230, 330, 430 may be such a master and each of thesensors 226, 426 may be such a slave. In alternative embodiments, aparallel connection is used.

The serial communication interface 500 may include a first resistor (R1)between a Vcc/Vin power line and a serial clock line (SCL) and a secondresistor (R2) between the Vcc/Vin power line and a serial data line(SDA). The serial clock line may be a clock (C) input into the sensor426 and the serial data line may be a data line (S) input into thesensor 426. A general purpose input/output (GPIOx) line may be areceiver mode (R) input from the host PCB 420 to the sensor 426. AnotherGPIOx input connects to a reset switch (RES). In this way, the host PCB420 can carry clock, data, mode, and reset signals from on-boardcomponents, including the microcontroller 430. In embodiments, thedetection signals of levels of the chemical gas contaminants may betransmitted over the serial data line (SDA) through the host PCB 420 andto additional signal processing components for conversion to measurementdata.

FIG. 6 is a schematic block diagram illustrative of a method 600 forconverting detection signals into measurement data for detected levelsof chemical gas contaminants and securely transmitting the measurementdata according to aspects of the disclosure. In various embodiments, themicrocontroller 430 of the detector disc 110 can retrieve instructionsfrom a memory 602, and execute the instructions to perform signalconversion as will be discussed. The microcontroller 430 may executecontrol over detection signals generated by the sensor 426, e.g., viaconnections of the host PCB 420, where the detection signals reflectdetected levels of the chemical gas contaminants as discussed earlier.The detection signals may be thought of as raw detection data.

The detector disc 110 may further include a signal conditioner 607,which is on board the microcontroller 430 or may be a separateprocessing components on the host PCB 420. The signal conditioner 607may power condition the detection signals to generate conditioned analogsignals capable of being transferred over longer flex cables.

In various embodiments, the microcontroller 430 executes software 603(e.g., software code or instructions retrieved from the memory 602) toprocess the conditioned analog signals into measurement data that may betransmitted and processed for user consumption. In one embodiment, thememory 602 is memory card 217 or 417. In another embodiment, theconditioned analog signals are transmitted to another device such as thecontroller 109 (or other networked device) that can perform the softwareprocessing. In one embodiment, the microcontroller 430 includes ananalog-to-digital converter (ADC) to convert the conditioned detectionsignals into digital detection data that can then be measured. Forexample, the microcontroller 430 can further execute an applicationsalgorithm 611 to convert the digital detection data into the measurementdata associated with discrete values (e.g., in ppm) of the detectedlevels of the chemical gas contaminants.

After the microcontroller 430 executes the software 603, the wirelesscommunication circuit 440 may transmit the measurement data to aninternet-of-things (IoT) device 660, which may act as an IoT gateway forstoring the measurement data to a cloud data server 662A and/or awebserver 662B. If the controller 109 (or other network-enabledcomputing device) executes the software 603, the controller 109 (orother network-enable computing device) may send the measurement data tothe IoT device 660. The IoT device 660 may provide a secure gateway orrouter for transmitting the measurement data to be stored at the clouddata server 662A and/or the webserver 662B. The measurement data may besecurely stored at either or both of the cloud data server 662A and/orthe webserver 662B, and accessed by a processing device 609. In analternative embodiments (indicated with the dashed line) the wirelesscommunication circuit 440 transmits the measurement data directly to thecloud data server 662A or the webserver 662B.

In various embodiments, the IoT device 660 may include a communicationunit 664, e.g., that includes a transceiver to store to and retrieve themeasurement data from the cloud data server 662A and/or the webserver662B. The IoT device 660 may further include a graphical user interface(GUI) 666 with which a processing device 609 can interact to receive andreview the measurement data in a human accessible form. The processingdevice 609 may be a client device, a computing device, a mobile device,or the like. In some embodiments, the processing device 609 can directlyaccess the measurement data from the cloud data server 662A and/or thewebserver 662B.

In various embodiments, the network communications between the detectordisc 110, the controller 109, the cloud data server 662A and/orwebserver 662B, and the processing device 609 may be secured viasecurity protocols, to include verification, authentication, andencryption, or a combination of the same. In one embodiment, all ofthese devices are co-located on a single local area network (LAN) thathas not outside connection to the internet (or other wide area network),and is secured by being physically separate from other computernetworks.

FIG. 7 is a flow chart of a method 700 for using a detector disc, whichincludes a sensor for detecting levels of chemical gas contaminantsaccording various aspects of the disclosure. For example, the method 700may be implemented using the detector disc 110 in conjunction with thefactory interface robot 111 (first robot) and the transfer chamber robot112 (second robot).

With reference to FIG. 7, at operation 710, the first robot moves thedetector disc 110 from a storage location through a factory interfaceinto a load lock of a processing system 100, where the detector discincludes a sensor adapted to detect levels of chemical gas contaminantsin air; and a wireless communication circuit coupled to the sensor. Thesensor may be a solid state sensor or a micro solid state sensor.

At operation 720, the second robot moves the detector disc 110 from theload lock through a transfer chamber and into a processing chamber ofthe processing system. At operation 730, the sensor detects the levelsof chemical gas contaminants within at least one of the storagelocation, the factory interface, the load lock, the transfer chamber, orthe processing chamber.

With continued reference to FIG. 7, the detector disc 110 transmits,with the wireless communication circuit of the detector disc,measurement data wirelessly to a wireless access point (WAP) device. Themeasurement data may include information indicative of the detectedlevels of chemical gas contaminants within the at least one of thestorage location, the factory interface, the load lock, the transferchamber, or the processing chamber.

Similar or corresponding operations may be performed during a returntrip to the storage location. For example, the second robot can move thedetector disc from the processing chamber through the transfer chamberand back into the load lock of the processing system. The first robotmay move the detector disc from the load lock through the factoryinterface and back into the storage location of the processing system.The sensor of the detector disc may detect the levels of chemical gascontaminants within at least one of the processing chamber, the transferchamber, the load lock, the factory interface, or the storage locationduring a return trip of the detector disc to the storage location. Thewireless communication circuit of the detector disc can further transmitsecond measurement data wirelessly to the WAP device. The secondmeasurement data may include information indicative of the levels ofchemical gas contaminants within the at least one of the processingchamber, the transfer chamber, the load lock, the factory interface, orthe storage location on the return trip.

FIG. 8 is a flow chart of a method 800 for using a detector disc, whichincludes a sorbent tube, for detecting levels of chemical gascontaminants according various aspects of the disclosure. For example,the method 700 may be implemented using the detector disc 310 inconjunction with the factory interface robot 111 (first robot) and thetransfer chamber robot 112 (second robot).

With reference to FIG. 8, at operation 810, the first robot moves thedetector disc 310 from a storage location through a factory interfaceinto a load lock of a processing system, where the detector discincludes a sorbent tube adapted to trap chemical gas contaminants inambient air, and a MEMS pump adapted to force the ambient air into thesorbent tube.

At operation 820, a controller such as the microcontroller 330 activatesthe MEMS pump on the detector disc 310, e.g., upon detecting movementthrough the processing system 100 or in response to anther trigger, suchas a command signal. At operation 830, the second robot moves thedetector disc 310 from the load lock through the transfer chamber andinto a processing chamber of the processing system 100.

At operation 840, the controller automatically shuts off the MEMS pumpafter a calibrated time period to trap the ambient air of at least oneof the storage location, the load lock, the factory interface, thetransfer chamber, or the processing chamber, in the sorbent tube.Because the detector disc 310 has multiple sorbent tubes, a separatesorbent tube may be activated within each one of these different toollocations in order to isolate the ambient air in respective sorbent tubeto particular parts or areas of the processing system 100.

The preceding description sets forth numerous specific details such asexamples of specific systems, components, methods, and so forth, inorder to provide a good understanding of several embodiments of thepresent invention. It will be apparent to one skilled in the art,however, that at least some embodiments of the present invention may bepracticed without these specific details. In other instances, well-knowncomponents or methods are not described in detail or are presented insimple block diagram format in order to avoid unnecessarily obscuringthe present invention. Thus, the specific details set forth are merelyexemplary. Particular implementations may vary from these exemplarydetails and still be contemplated to be within the scope of the presentinvention.

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure, orcharacteristic described in connection with the embodiment is includedin at least one embodiment. Thus, the appearances of the phrase “in oneembodiment” or “in an embodiment” in various places throughout thisspecification are not necessarily all referring to the same embodiment.In addition, the term “or” is intended to mean an inclusive “or” ratherthan an exclusive “or.” When the term “about” or “approximately” is usedherein, this is intended to mean that the nominal value presented isprecise within ±10%.

Although the operations of the methods herein are shown and described ina particular order, the order of the operations of each method may bealtered so that certain operations may be performed in an inverse orderor so that certain operation may be performed, at least in part,concurrently with other operations. In another embodiment, instructionsor sub-operations of distinct operations may be in an intermittentand/or alternating manner. In one embodiment, multiple metal bondingoperations are performed as a single step.

It is to be understood that the above description is intended to beillustrative, and not restrictive. Many other embodiments will beapparent to those of skill in the art upon reading and understanding theabove description. The scope of the invention should, therefore, bedetermined with reference to the appended claims, along with the fullscope of equivalents to which such claims are entitled.

What is claimed is:
 1. A detector disc comprising: a disc body comprising a bottom disc and a top cover, the top cover comprising a first aperture and a sidewall that is attached to the bottom disc; a sensor disposed within an interior formed by the disc body and positioned to be exposed to an external environment via the first aperture in the top cover, wherein the sensor is adapted to detect levels of chemical gas contaminants and output a detection signal based on detected levels of the chemical gas contaminants; a microcontroller disposed within the interior of the disc body and coupled to the sensor, the microcontroller adapted to generate measurement data from the detected levels of the chemical gas contaminants embodied within the detection signal; and a wireless communication circuit disposed within the interior of the disc body and coupled to the microcontroller, the wireless communication circuit adapted to transmit the measurement data wirelessly to a wireless access point device.
 2. The detector disc of claim 1, wherein the sensor is adapted to detect the levels of chemical gas contaminants in parts per million of particles of at least one of airborne molecular contaminants or volatile organic compounds.
 3. The detector disc of claim 1, wherein the sensor is a solid state sensor that is to: measure fifty percent of a concentration of the levels of the chemical gas contaminants within 10 seconds; and measure ninety percent of the concentration of the levels of the chemical gas contaminants within 30 seconds.
 4. The detector disc of claim 1, further comprising a printed circuit board (PCB) disposed within the interior of the disc body and on which is disposed at least the sensor, wherein the bottom disc comprises a substrate and the sidewall encloses the PCB, the sidewall comprising at least one opening to provide access to connector interfaces attached to the PCB.
 5. The detector disc of claim 1, further comprising: a printed circuit board (PCB) disposed within the interior of the disc body and on which is disposed at least the sensor; and a serial communication interface that couples the sensor to the PCB, the serial communication interface to transmit the detection signal from the sensor to the PCB, and wherein the serial communication interface is one of a serial peripheral interface or an inter-integrated circuit interface.
 6. The detector disc of claim 1, wherein the top cover comprises a second aperture located proximate to the first aperture, the detector disc further comprising: a printed circuit board (PCB) disposed within the interior of the disc body and on which is disposed at least the sensor; and an axial fan disposed on the PCB beneath the second aperture, wherein the axial fan is to move air across the sensor.
 7. The detector of claim 6, wherein the PCB comprises a third aperture positioned below the second aperture and the axial fan is disposed on the PCB between the second and third apertures to move air across the sensor in through the second aperture and out through the third aperture of the PCB.
 8. The detector disc of claim 1, further comprising a printed circuit board (PCB) disposed within the interior of the disc body and on which is disposed at least the sensor, wherein the top cover comprises a set of first apertures, which include the first aperture, and wherein the detector disc further comprises a set of sensors disposed on the PCB, the set of sensors comprising the sensor, wherein each sensor of the set of sensors is positioned proximate to one of the set of first apertures.
 9. The detector disc of claim 8, wherein the top cover comprises a set of second apertures proximate to the set of first apertures and the PCB comprises a set of third apertures positioned below the set of second apertures, and wherein the detector disc further comprises a set of axial fans disposed on the PCB between the set of second apertures and the set of third apertures, the set of axial fans to move air across the set of sensors.
 10. The detector disc of claim 1, further comprising: a printed circuit board (PCB) disposed within the interior of the disc body, wherein the sensor, the microcontroller, and the wireless communication circuit are disposed on the PCB; a memory card disposed on the PCB, the memory card to store the measurement data; a battery disposed on the PCB; and a power manager coupled to the battery, the power manager comprising a booster converter to convert a voltage source of the battery to a power level sufficient to power at least the microcontroller, the sensor, and the memory card.
 11. The detector disc of claim 1, wherein a thickness of the disc body is between 6 millimeters (mm) and 9 mm, and wherein a diameter of the disc body is approximately 190 mm to 320 mm.
 12. A detector disc comprising: a substrate disc; a sorbent tube attached to the substrate disc, the sorbent tube comprising a first opening at a first end that is capped and a second opening at a second end; a micro-electromechanical system (MEMS) pump disposed the substrate disc, the MEMS pump comprising an air tube attached to the second opening of the sorbent tube to force ambient air into the sorbent tube, wherein the MEMS pump is to automatically shut off after a calibrated time period after activation; and a microcontroller disposed on the substrate disc and coupled to the MEMS pump, the microcontroller to activate the pump.
 13. The detector disc of claim 12, wherein a thickness of the detector disc is between 6 millimeters (mm) and 9 mm, and wherein the sorbent tube is attached to the substrate disc with a clamp.
 14. The detector disc of claim 12, further comprising: a printed circuit board (PCB) disposed on a central portion of the substrate disc, wherein the MEMS pump and the microcontroller are disposed on the PCB; a second sorbent tube attached to the substrate disc, the second sorbent tube comprising a third opening at a first end that is capped and a fourth opening at a second end; and a second MEMS pump disposed on one of the substrate disc or the PCB and comprising a second air tube attached to the fourth opening of the second sorbent tube to force ambient air into the second sorbent tube, wherein the second MEMS pump is to automatically shut off after the calibrated time period after activation; and wherein the microcontroller is further coupled to the second MEMS pump, the microcontroller further to activate the second MEMS pump.
 15. The detector disc of claim 12, wherein the ambient air is ambient air of at least one of a storage location, a factory interface, a load lock, a transfer chamber, or a processing chamber of a substrate processing system.
 16. A method comprising: moving, by a first robot, a detector disc from a storage location through a factory interface into a load lock of a processing system, the detector disc comprising: a sensor adapted to detect levels of chemical gas contaminants in air; and a wireless communication circuit coupled to the sensor; moving, by a second robot, the detector disc from the load lock through a transfer chamber and into a processing chamber of the processing system; detecting, using the sensor of the detector disc, the levels of chemical gas contaminants within at least one of the storage location, the factory interface, the load lock, the transfer chamber, or the processing chamber; and transmitting, with the wireless communication circuit of the detector disc, measurement data wirelessly to a wireless access point (WAP) device, wherein the measurement data comprises information indicative of the detected levels of chemical gas contaminants within the at least one of the storage location, the factory interface, the load lock, the transfer chamber, or the processing chamber.
 17. The method of claim 16, wherein transmitting comprises at least one of: transmitting a first portion of the measurement data to the WAP device while the detector disc is in the storage location; transmitting a second portion of the measurement data to the WAP device while the detector disc is in the factory interface; transmitting a third portion of the measurement data to the WAP device while the detector disc is in the load lock; transmitting a fourth portion of the measurement data to the WAP device while the detector disc is in the transfer chamber; and transmitting a fifth portion of the measurement data to the WAP device while the detector disc is in the processing chamber.
 18. The method of claim 16, further comprising: moving, by the second robot, the detector disc from the processing chamber through the transfer chamber and back into the load lock of the processing system; moving, by the first robot, the detector disc from the load lock through the factory interface and back into the storage location of the processing system; detecting, using the sensor of the detector disc, the levels of chemical gas contaminants within at least one of the processing chamber, the transfer chamber, the load lock, the factory interface, or the storage location during a return trip of the detector disc to the storage location; and transmitting, with the wireless communication circuit, second measurement data wirelessly to the WAP device, wherein the second measurement data comprises information indicative of the levels of chemical gas contaminants within the at least one of the processing chamber, the transfer chamber, the load lock, the factory interface, or the storage location on the return trip.
 19. The method of claim 16, further comprising calibrating the sensor within air located outside a factory interface that includes the storage location, wherein the calibrating comprising establishing a baseline of levels of the chemical gas contaminants detected by the sensor.
 20. The method of claim 16, further comprising: receiving a detection signal, from the sensor, indicative of the detected levels of chemical gas contaminants; conditioning, using a signal conditioner, the detection signal to generate a conditioned analog signal; converting, using an analog-to-digital converter, the conditioned analog signal to a digital signal; and converting the digital signal to generate the measurement data via measuring discrete values of the detected levels of chemical gas contaminants within the digital signal. 